Customization: | Available |
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Application: | Automobile, Electronics Power Supply/LED Lighting |
Bonding Function: | High Temperature Resistant Adhesive |
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PS Heat-conducting Potting Compound is a kind of low viscosity flame retardant two component addition type silicone thermal conductive potting adhesive, which can be cured at room temperature or by heating, and has the characteristics that the higher the temperature is, the faster the curing speed is. The product does not produce any byproducts in the curing reaction, and can be applied to the surfaces of PC (poly-carbonate), PP, ABS, PVC and other materials and metals.It is suitable for heat conduction, insulation, waterproof, sealing and flame retardant of electronic accessories.
---Superior Thermal Conductivity: Rapidly transfers heat, keeping components at optimal operating temperatures.
---Exceptional Electrical Insulation: High dielectric strength protects against short - circuits and electrical interference.
---Wide Temperature Resistance: Withstands high temperatures up to 200°C and maintains flexibility down to -50°C for extreme environments.
---Easy Application: Self - leveling and user - friendly dispensing simplify the potting process, reducing labor costs.
---Strong Bonding: Bonds firmly to metals, plastics, ceramics, creating a waterproof, dust - proof seal.
Test Item | Unit | PS-10 | PS-15 | PS-20 | PS-30 | Test method |
Composition | / | Organic silicon + ceramic | ||||
Color/Component A | / | White | White | White | White | Visual |
Color/Component B | / | Grey | Grey | Grey | Grey | Visual |
Viscosity/Component A | / | 4500±500 | 5000±500 | 6000±1000 | 8000±2000 | GB/T2794 |
Viscosity/Component B | / | 4500±500 | 5000±500 | 6000±1000 | 8000±2000 | GB/T1995 |
Mixing ratio | / | 1:1 | 1:1 | 1:1 | 1:1 | |
Density | g/cc | 1.8±0.1 | 2.5±0.1 | 2.8±0.1 | 3.1±0.1 | ASTM D792 |
Operating Time (adjustable) | Min | 30 | 30 | 30 | 30 | GB/T7123.1-2015 |
Hardness after curing Shore A | / | 55±5 | 45±5 | 35±5 | 35±5 | ASTM D2240 |
Temperature resistance range | ºC | -50~200 | -50~200 | -50~200 | -50~200 | - |
Breakdown voltage | Kv/mm | ≥12 | ≥12 | ≥12 | ≥12 | ASTM D149 |
Volume resistivity | Ω.cm | ≥1*1013 | ≥1*1013 | ≥1*1013 | ≥1*1013 | ASTM D257 |
Dielectric constant | @ 1MHz | 5.5 | 5.6 | 7.5 | 7.5 | ASTM D150 |
Fire rating | / | V-0 | V-0 | V-0 | V-0 | UL94 |
Thermal conductivity | W/m-k | 1.0±0.1 | 1.5±0.1 | 2±0.2 | 3±0.3 | ASTM D5470 |
ShenZhen DuBang Technology Co., LTD produce thermal conductive and heat dissipation materials. We are a thermal solution provider integrating production, design, R&D and sales.
Q: Are you trading company or manufacturer ?
A: We are manufacturer, our factory in Dongguan city, China. Welcome to visit us.
Q: How long is your delivery time?
A: Each 100,000 pieces, we need about 3 days to produce.
Q: Do you provide samples ? is it free or extra ?
A: Sample is available, please you need to pay for it.
Q: How to customize a sample?
A: Please send us design of your products, such as size, shape, etc. We can customize your products.